High voltage capacitors

ABSTRACT

A capacitor includes a ceramic capacitor body having opposite ends and comprised of a plurality of electrode layers and dielectric layers and first and second external terminals attached to the ceramic capacitor body. The internal active electrodes within the ceramic capacitor body are configured in an alternating manner. Internal electrode shields within the ceramic capacitor body are used to assist in providing resistance to arc-over. The shields can include a top internal electrode shield and an opposite bottom internal electrode shield wherein the top internal electrode shield and the opposite bottom internal electrode shield are on opposite sides of the plurality of internal active electrodes and each internal electrode shield extends inwardly to or beyond a corresponding external terminal to thereby provide shielding. Side shields are used. The capacitor provides improved resistance to arc-over, high voltage breakdown in air, and allows for small case size.

BACKGROUND OF THE INVENTION

Multilayer ceramic capacitors generally have alternating layers ofceramic dielectric material and conductive electrodes. Various types ofdielectric materials can be used and various types of physicalconfigurations have been used. Capacitors for high voltage performancehave been produced for many years using a “series design”. In the seriesdesign the charge is stored between the floating electrode andelectrodes connected to the terminals on either side as shown for asingle floating electrode designs in FIG. 1. This compares to a standardcapacitor design shown in FIG. 2 in which the electrodes alternativelyconnect to different terminals and the charge is stored between theseelectrodes. The capacitance for these designs is given by:C=∈o∈rAN/TWhere C=Capacitance in F

-   ∈o=Permittivity of Free Space=8.854×10⁻¹²Fm⁻¹-   ∈r=Permittivity of the Ceramic Material, a material dependent    dimensionless constant-   A=Effective Overlap Area of Electrodes m²-   N=Number of electrodes−1-   T=Fired Active Thickness of Ceramic Separating the Layers

However, in the case of the series design the effective overlap area issignificantly reduced. The advantage of the series design is that theinternal voltage acting on the electrodes is halved for the singlefloating electrode. It is possible to further separate the floatingelectrode to give more than one floating electrode per layer to reducethe internal voltage but this also lowers the effective overlap areareducing capacitance. The average voltage breakdowns (n=50) for 27 lotsof case size 1812 MLCCs, 47 nF±10% standard designs and the same numberof case size 1812, 22 nF±10% single floating electrode series designsare shown in FIG. 3. In all these cases the fired active thicknessseparating the electrodes was 0.0023″, 58 microns with an overallthickness of 0.051±0.003″ (1.30±0.08 mm) for the standard design and0.068±0.003″ (1.73±0.08 mm) for the series capacitors. The length andwidth dimensions were 0.177±0.010″ (4.50±0.25 mm) and 0.126±0.008″(3.20±0.20 mm) respectively for all these 1812 case size capacitors.Cross-sections of the 1812 standard design and the single electrodeseries design are shown in FIGS. 4 and 5 respectively.

In addition to the internal voltage withstanding capability of theseMLCCs it is also critical that these parts are resistant to arc-overfrom the capacitor terminals. U.S. Pat. No. 4,731,697, to McLarneydiscloses a surface electrode with portions of the margin covered by afurther dielectric layer to prevent arc over that requires lasertrimming. However, it is important to note that exposed electrodes aresubject to corrosion. Also the properties of exposed electrodes aresignificantly impacted by the environment factors, such as humidity,limiting the applications in which these capacitors can be used.

U.S. Pat. No. 6,627,509 to Duva discloses a method for producing surfaceflashover resistant capacitors by applying a para-poly-xylylene coatingto the surface of multilayer ceramic capacitors followed by trimming theexcess material from the terminals. In this case significant costs areassociated with coating of the capacitors. Furthermore, the coating maynot be compatible with the circuit board assembly processes and thepresence of organic coatings in some electronic application such assatellites is limited because of out gassing concerns.

Thus, despite various efforts to reduce produce capacitors with highvoltage breakdown and which minimize occurrence of arc over, problemsremain. What is needed is an improved high voltage capacitor.

BRIEF SUMMARY OF THE INVENTION

Therefore, it is a primary object, feature, or advantage of the presentinvention to improve upon the state of the art.

It is a further object, feature, or advantage of the present inventionto provide a multilayer ceramic capacitor which is resistant toarc-over.

It is a still further object, feature, or advantage of the presentinvention to provide a multilayer ceramic capacitor with high voltagebreakdown in air.

A still further object, feature, or advantage of the present inventionis to provide a multilayer ceramic capacitor with a design which retainshigh capacitance.

Another object, feature, or advantage of the present invention is tominimize the occurrence of unwanted disruptions due to arc-over when thecapacitor is incorporated into an electronic circuit.

Yet another object, feature, or advantage of the present invention is toprovide a capacitor with high voltage withstanding capability with asmaller case size allowing for miniaturization of circuits.

A further object, feature, or advantage of the present invention is toprovide an improved capacitor which can be manufactured conveniently andeconomically.

One or more of these and/or other objects, features, or advantages ofthe present invention will become apparent from the specification andclaims that follow.

According to one aspect of the present invention, a multilayer ceramiccapacitor component is provided. The capacitor component includes aceramic capacitor body having opposite ends and comprised of a pluralityof electrode layers and dielectric layers. The capacitor componentfurther includes first and second external terminals attached to theceramic capacitor body. The capacitor component also includes aplurality of internal active electrodes within the ceramic capacitorbody configured in an alternating manner such that a first of theplurality of internal active electrodes extends from one end of theceramic capacitor body inwardly and a next internal active electrodeextends from an opposite end of the ceramic capacitor body inwardly.There is also a plurality of internal electrode shields within theceramic capacitor body to thereby assist in providing resistance toarc-over. The plurality of internal electrode shields include a topinternal electrode shield and an opposite bottom internal electrodeshield wherein the top internal electrode shield and the opposite bottominternal electrode shield are on opposite sides of the plurality ofinternal active electrodes and each internal electrode shield extendsinwardly to or beyond a corresponding external terminal to therebyprovide shielding. There are also side shields. Each side shield extendsinwardly from one end of the capacitor body and the side shields areconfigured to further shield an active electrode to thereby furtherresist arc over between active electrodes and terminals.

According to another aspect of the present invention, a multilayerceramic capacitor component for providing improved high voltagecharacteristics is provided. The capacitor includes a ceramic capacitorbody having opposite ends and comprised of a plurality of electrodelayers and dielectric layers. First and second external terminals areattached to the ceramic capacitor body. The plurality of electrodelayers include a top layer having an electrode shield extending inwardlyto or beyond the first terminal, a bottom layer having an electrodeshield extending inwardly to or beyond the second terminal, and aplurality of alternating layers of active electrodes extending inwardlyfrom alternating ends of the ceramic capacitor body. Each of thealternating layers of active electrodes also includes side shields.

According to another aspect of the present invention a method ofmanufacturing a multilayer ceramic component is provided. The methodincludes forming a ceramic capacitor body from a plurality of electrodelayers and dielectric layers and attaching first and second externalterminals on opposite ends of the ceramic capacitor body. The pluralityof electrode layers comprises layers of active electrodes and layers ofshielding electrodes and wherein the layers of active electrodes areconfigured in an alternating manner such that a first of the pluralityof active electrodes extends from one end of the ceramic capacitor bodyinwardly and a next internal active electrode extends from an oppositeend of the ceramic capacitor body inwardly. The layers of shieldingelectrodes include a top internal electrode shield and an oppositebottom internal electrode shield wherein the top internal electrodeshield and the opposite bottom internal electrode shield are on oppositesides of the plurality of active electrodes and each electrode shieldextends inwardly to or beyond a corresponding external terminal tothereby provide shielding. The layers of active electrodes also includeslayers of side shields on opposite sides of the active electrodes tothereby provide additional shielding.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram of a cross-section through a series capacitor designwith a single floating electrode.

FIG. 2 is a diagram of a cross-section through a standard capacitorsign.

FIG. 3 shows an average voltage breakdown of series and standardcapacitor designs.

FIG. 4A shows a cross-section photograph of 1812 MLCC standard design.

FIG. 4B shows an end view photograph of an 1812 MLCC standard design.

FIG. 5A is a cross-section photograph of 1812 MLCC single floatingelectrode series design.

FIG. 5B shows an end view photograph of an 1812 MLCC single floatingelectrode series design.

FIG. 6 is a diagram of capacitor designs according to severalembodiments of the present invention.

FIG. 7 is a table showing the average capacitance and dimensions for thecapacitor designs of FIG. 6.

FIG. 8A is a side view cross-section drawing of Example 1.

FIG. 8B is an end view cross-section drawing of Example 1.

FIG. 9A is a side view cross-section drawing of Example 2.

FIG. 9B is an end view cross-section drawing of Example 2.

FIG. 10A is a side view cross-section drawing of Example 3.

FIG. 10B is an end view cross-section drawing of Example 3.

FIG. 11 shows a voltage breakdown of Examples 1, 2 and 3.

FIG. 12A is a photograph of a cross-section of Example 1.

FIG. 12B is a photograph of an end view of the cross-section of Example1.

FIG. 13A is a photograph of a cross-section of Example 2.

FIG. 13B is a photograph of an end view of the cross-section of Example2.

FIG. 14A is a photograph of a cross-section of Example 3.

FIG. 14B is a photograph of an end view of the cross-section of Example3.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

This invention describes a novel arrangement of internal electrodes thatresults in an arc resistant multilayer ceramic capacitor with very highvoltage breakdown in air. Furthermore these designs retain a highcapacitance. To assist in describing the present invention, each ofthree designs and MLCC performance is described and then a more detaileddescription of each example is provided with reference to the drawings.The designs and MLCC performance is described in the following examples.

EXAMPLE 1

A standard case size 1206 capacitor design was manufactured using aproduction MLCC X7R materials system C-153.

EXAMPLE 2

A case size 1206 capacitor design was manufactured using a productionMLCC X7R materials system C-153 with shield electrodes on top andbottom. The purpose of these shield electrodes is to prevent an arc-overbetween the terminal and the internal electrode of opposite polarity oracross the top or bottom surface of the capacitor between terminals ofopposite polarity. For this reason it is only necessary to have oneshield electrode present in the case where the active below is ofopposite polarity. However, during the course of manufacturingcapacitors of different values by shielding both terminal areas at thetop and bottom of the capacitor there is no need to change the screensfor different numbers of electrodes improving manufacturability.

EXAMPLE 3

A case size 1206 capacitor design was manufactured using a productionMLCC X7R materials system C-153 with side shield electrodes on eitherside of the active in additions to shield electrodes on top and bottom.The purpose of the side shield electrode is to prevent an arc-overbetween the terminal and different internal electrode layers of oppositepolarity or across the sides of the capacitor between terminals ofopposite polarity. As for the top and bottom side shield electrodes, twoside shield electrodes on each side were used but it is only necessaryto have one side shield electrode at the side of each layer withterminal of opposing polarity. The two side shield electrodes on eachside allows to accurately check alignment of the electrode stack.

The design and electrode pattern for all three examples is shown in FIG.6. Terminals were applied to these examples consisting of a thick filmfired silver paste and these were then over plated with nickel followedby tin. The parts were screened through a 1000V Hi-Pot and IR verified.The average capacitances (n=100) and dimensions (n=5) were measured asshown in FIG. 7.

It can be seen that the Number of Electrodes−1 (N) are almost the samefor all these examples, 27±1. The Fired Active Thickness of CeramicSeparating the Layers (T) is also the same for all three examples andsince the same ceramic material system was used to manufacture all thecapacitors the Permittivity (∈r) is the same. The only variableaffecting capacitance is therefore the Effective Overlap Area ofElectrodes (A). This is lower for Example 3 because of the presence ofthe side-shields. The actual cross-sections of Examples 1, 2 and 3 areshown in FIGS. 12A and 12B (Example 1), FIGS. 13A and 13B (Example 2)and FIGS. 14A and 14B (Example 3)

A sample of 50 capacitors for examples 1, 2 and 3 were tested to failureby applying voltage at a ramp rate of 500V/s per method 103 of EIA198-2-E. The results are shown in FIG. 11. The instrument used fortesting was the Associated Research 7512DT HiPot. Data of FIG. 11represents dielectric breakdown voltage levels, which include arc-overand or physical destruction. Post IR testing of Example 1 parts had13/50 Insulation Resistance (IR) failures, Examples 2 and 3 had 48/50and 50/50 IR failures respectively indicating that failures due toarc-over were not observed in Example 3. It is also important to notethat repeated arc-over occurrences on applying voltage would eventuallycause IR failure.

It can clearly be seen that Example 3 has the highest average voltagebreakdown>2.5 kV of the examples cited. The voltage breakdown andcapacitance of the 1206 case size capacitor in Example 3 are similar tothe 1812 1000V rated single floating electrode serial capacitorsdescribed in the prior art. The capacitors described in Example 3therefore allow the circuits required to handle high voltages to besignificantly miniaturized.

FIG. 1 illustrates a prior art capacitor design. In FIG. 1, a capacitor10 is shown with a first terminal 12 and an opposite second terminal 14on the opposite end of the capacitor body 16. Floating electrodes 18 areshown. FIG. 2 illustrates another prior art capacitor design. In FIG. 2,instead of floating electrodes, the electrodes alternate. FIG. 3compares the series and standard designs. In particular, FIG. 3 showsthe average voltage breakdowns (n=50) for 27 lots of case size 1812MLCCs, 47 nF±10 percent standard designs and the same number of casesize 1812, 22 nF±10 percent single floating electrode series designs. Inall these cases the fired active thickness separating the electrodes was0.0023″, 58 microns with an overall thickness of 0.051±0.003″ (1.30±0.08mm) for the standard design and 0.068±0.003″ (1.73±0.08 mm) for theseries capacitors. The length and width dimensions were 0.177±0.010″(4.50±0.25 mm) and 0.126±0.008″ (3.20±0.20 mm) respectively for allthese 1812 case size capacitors. Cross-sections of the 1812 standarddesign and the single electrode series design are shown in FIGS. 4A-4Band 5A-5B, respectively.

FIG. 6 is a table which shows three different capacitor design examples.The first example is a standard design used for comparison purposes. Thesecond example is one embodiment of the present invention where top andbottom shields are used. The third example is another embodiment of thepresent invention where both top and bottom shields as well as sideshields are used.

As shown in FIG. 6, in the standard design, the fired active thicknessof the capacitor is 0.0020 inches or 51 microns. The standard designincludes 26 active electrodes. In the top/bottom shield design, thefired active thickness of the capacitor is also 0.0020 inches or 51microns. The top/bottom shield design includes 27 active electrodes. Inthe top/bottom and side shield design, the fired active thickness is0.0020 inches or 51 microns. In the top/bottom side shield design thereare 28 active electrodes.

FIG. 6 also shows the electrode layout plans for the various types ofdesign. According to the standard design there is a first electrode 20and a staggered second electrode 22. A third electrode 24 is alignedwith the first electrode 20. A fourth electrode 26 is aligned with thesecond electrode 22. This alternating pattern continues, with additionalalternating electrodes until the second to last electrode, N−1, and thelast electrode 30.

In the top/bottom shield design the first electrode layer includes afirst top shield 32 and a second top shield 34 as well as a first bottomshield 36 and a second bottom shield 38. It is of particular note thatonly the first top shield 32 and the second bottom shield 38 areactive—the other shields need not even be present. The first top shield32 and second bottom shield 38 are necessary to prevent arc-over fromterminations of opposed polarity and shields 34 and 26 are present formanufacturing convenience.

In the top/bottom and side shields embodiment, there is a first topshield 32 and a second top shield 34 as well as a first bottom shield 36and a second bottom shield 38. For each active electrode there are alsoside shields 40, 42, 44, 46, 48, 50, 52, 54, 56, 58, 60, 62, 64, 66, 68,and 70. The side shields 40, 42, 52, 54, 56, 58, 68, and 70 are requiredto protect the inner active electrodes from arc over from thetermination of opposed polarity whereas the other side shields wereincluded to test the electrode alignment within the parts.

The designs shown in FIG. 6 are further illustrated in FIGS. 8A to 10B.FIG. 8A is a cross-section of Example 1 (standard design) while FIG. 8Bis an end view of the cross-section of Example 1. In FIG. 8A, amultilayer ceramic capacitor component 48 is shown with a first terminal12 and a second terminal 14 on opposite ends of a multilayer ceramiccapacitor component 16. The internal active electrodes of the ceramiccapacitor body are configured in alternating manners such that a firstinternal active electrode 20 extends from one end of the ceramiccapacitor body inwardly toward the terminal on the opposite end of theceramic capacitor body. The next internal active electrode 22 extendsfrom the opposite end of the ceramic capacitor body inwardly toward theterminal on the opposite end of the ceramic body. The end viewcross-section of FIG. 8B illustrates the electrodes.

FIG. 9A is a side view cross-section of Example 2 (top/bottom shields)while FIG. 9B is an end view of the cross-section of Example 2. In FIG.9A, a multilayer ceramic capacitor component 50 is shown. Note thepresence of the internal electrode shields within the ceramic capacitorbody which assist in providing resistance to arc-over between theterminals and internal electrodes. The internal electrode shields showninclude a top internal electrode shield 32 and an opposite bottominternal electrode shield 38. The top internal electrode shield 32 andthe opposite bottom internal electrode shield 38 are on opposite sidesof the multilayer ceramic capacitor body 16. Each internal electrodeshield 32, 38 extends inwardly to or beyond a corresponding terminal 12,14 to thereby provide shielding. As previously mentioned, additionalstructures 34, and 36 are provided but are not required as they do notprovide actual shielding due to the polarity of the terminals. They areincluded for convenience in the manufacturing process.

FIG. 10A is a side view cross-section of Example 3 (top/bottom shieldsand side shield) while FIG. 10B is an end view of the cross-section ofExample 3. The multilayer ceramic capacitor 60 of FIG. 10A includes notonly the top shield 32 and opposite bottom shield 38, but also sideshields. The side shields are best shown in FIG. 10B that depicts across-section through the capacitor. The side shield in question dependson the depth of the cross-section hence the side shields shown are 40,42, 48, and 50.

FIG. 7 provides a table for comparing the standard design to two designsaccording to the present invention. The table shows the averagecapacitance and dimensions for the capacitor designs of FIG. 6.

FIG. 11 shows a voltage breakdown of Examples 1, 2 and 3. Note that inFIG. 11, the top/bottom shield embodiment (Example 2) provides increasedvoltage break down relative to the standard design (Example 1). Thetop/bottom and side shield embodiment (Example 3) provides furtherincreased break down voltage. Thus, the present invention can be used tocreate multi-layer ceramic capacitors having voltage breakdowns above1000 V, 1500 V, 2000V, 2500 V, or even 3000V.

Therefore an improved high voltage capacitor has been disclosed. Thepresent invention is not to be limited to the specific embodiments shownin here. For example, the present invention contemplates numerousvariations in the types of dielectric used, types of conductors used,sizes, dimensions, packaging, and other variations.

1. A multilayer ceramic capacitor component comprising: a ceramiccapacitor body having opposite ends and comprised of a plurality ofelectrode layers and dielectric layers; first and second externalterminals attached to the ceramic capacitor body; a plurality ofinternal active electrodes within the ceramic capacitor body configuredin an alternating manner such that a first of the plurality of internalactive electrodes extends from one end of the ceramic capacitor bodyinwardly and a next internal active electrode extends from an oppositeend of the ceramic capacitor body inwardly; a plurality of internalelectrode shields within the ceramic capacitor body to thereby assist inproviding resistance to arc-over; the plurality of internal electrodeshields comprising a top internal electrode shield and an oppositebottom internal electrode shield wherein the top internal electrodeshield and the opposite bottom internal electrode shield are on oppositesides of the plurality of internal active electrodes and each internalelectrode shield extends inwardly to or beyond a corresponding externalterminal to thereby provide shielding; the plurality of internalelectrode shields further comprising a plurality of side shields, eachside shield extending inwardly from one end of the capacitor body andthe side shields configured to further shield an active electrode tothereby further resist arc over between active electrodes and terminals.2. The multilayer ceramic capacitor component of claim 1 wherein each ofthe plurality of internal active electrodes extends from one end of theceramic capacitor body substantially to the external electrode attachedto the opposite end of the ceramic capacitor body.
 3. The multilayerceramic capacitor component of claim 1 wherein the voltage breakdown forthe multilayer ceramic capacitor is greater than 1500 volts.
 4. Themultilayer ceramic capacitor component of claim 1 wherein the voltagebreakdown for the multilayer ceramic capacitor is greater than 2000volts.
 5. The multilayer ceramic capacitor component of claim 1 whereinthe voltage breakdown for the multilayer ceramic capacitor is greaterthan 2500 volts.
 6. The multilayer ceramic capacitor component of claim1 wherein the voltage breakdown for the multilayer ceramic capacitor isgreater than 3000 volts.
 7. A multilayer ceramic capacitor component forproviding improved high voltage characteristics, comprising: a ceramiccapacitor body having opposite ends and comprised of a plurality ofelectrode layers and dielectric layers; first and second externalterminals attached to the ceramic capacitor body; wherein the pluralityof electrode layers comprise a top layer having an electrode shieldextending inwardly to or beyond the first terminal, a bottom layerhaving an electrode shield extending inwardly to or beyond the secondterminal, and a plurality of alternating layers of active electrodesextending inwardly from alternating ends of the ceramic capacitor body;and wherein each of the plurality of alternating layers of activeelectrodes further comprises side shields.
 8. The multilayer ceramiccapacitor component of claim 7 wherein the voltage breakdown for themultilayer ceramic capacitor is greater than 1500 volts.
 9. Themultilayer ceramic capacitor component of claim 7 wherein the voltagebreakdown for the multilayer ceramic capacitor is greater than 2000volts.
 10. The multi layer ceramic capacitor component of claim 7wherein the voltage breakdown for the multilayer ceramic capacitor isgreater than 2500 volts.
 11. The multilayer ceramic capacitor componentof claim 7 wherein the voltage breakdown for the multilayer ceramiccapacitor is greater than 3000 volts.
 12. The multilayer ceramiccapacitor component of claim 7 wherein the ceramic capacitor body beingsized to fit within case size 1206 packaging.
 13. A method ofmanufacturing a multilayer ceramic component, comprising: forming aceramic capacitor body from a plurality of electrode layers anddielectric layers; attaching first and second external terminals onopposite ends of the ceramic capacitor body; wherein the plurality ofelectrode layers comprises layers of active electrodes and layers ofshielding electrodes and wherein the layers of active electrodes beingconfigured in an alternating manner such that a first of the pluralityof active electrodes extends from one end of the ceramic capacitor bodyinwardly and a next internal active electrode extends from an oppositeend of the ceramic capacitor body inwardly; wherein the layers ofshielding electrodes comprise a top internal electrode shield and anopposite bottom internal electrode shield wherein the top internalelectrode shield and the opposite bottom internal electrode shield areon opposite sides of the plurality of active electrodes and eachelectrode shield extends inwardly to or beyond a corresponding externalterminal to thereby provide shielding; wherein the layers of activeelectrodes further comprise layers of side shields on opposite sides ofthe active electrodes to thereby provide additional shielding.
 14. Amultilayer ceramic capacitor component comprising: a ceramic capacitorbody having opposite ends and comprised of a plurality of electrodelayers and dielectric layers; first and second external terminalsattached to the ceramic capacitor body; a plurality of internal activeelectrodes within the ceramic capacitor body configured in analternating manner such that a first of the plurality of internal activeelectrodes extends from one end of the ceramic capacitor body inwardlyand a next internal active electrode extends from an opposite end of theceramic capacitor body inwardly; a plurality of internal electrodeshields within the ceramic capacitor body to thereby assist in providingresistance to arc-over; the plurality of internal electrode shieldscomprising a plurality of side shields, each side shield extendinginwardly from one end of the capacitor body and the side shieldsconfigured to shield a corresponding active electrode to thereby resistarc over between active electrodes and terminals.
 15. The multilayerceramic capacitor component of claim 14 wherein the plurality ofinternal electrode shields further comprises a top internal electrodeshield and an opposite bottom internal electrode shield wherein the topinternal electrode shield and the opposite bottom internal electrodeshield are on opposite sides of the plurality of internal activeelectrodes and each internal electrode shield extends inwardly to orbeyond a corresponding external terminal to thereby provide shielding.16. A method of manufacturing a multilayer ceramic component,comprising: forming a ceramic capacitor body from a plurality ofelectrode layers and dielectric layers; attaching first and secondexternal terminals on opposite ends of the ceramic capacitor body;wherein the plurality of electrode layers comprises layers of activeelectrodes and layers of shielding electrodes and wherein the layers ofactive electrodes being configured in an alternating manner such that afirst of the plurality of active electrodes extends from one end of theceramic capacitor body inwardly and a next internal active electrodeextends from an opposite end of the ceramic capacitor body inwardly;wherein the layers of active electrodes further comprise layers of sideshields on opposite sides of the active electrodes to thereby provideshielding.